IP Library Assignment 026446/0677
Patent Assignment
Reel/Frame 026446/0677

Change of Name

Recorded: 2011-06-15 Pages: 7
Assignor
MOTOROLA, INC
Executed: 2011-01-04
Assignee
MOTOROLA SOLUTIONS, INC.
1303 E. ALGONQUIN ROAD, IL01 / 11TH FLOOR, SCHAUMBURG, ILLINOIS, 60196
Covered Property (1)
Localized Enhancement of Multilayer Substrate Thickness for High Q Rf Components
Patent: 7,221,244 →
Application: 11/237,056 →
Publication: US 2006/0027385
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 15, 2011
From: ESTES, JOHN C.; LUCERO, RODOLFO; PAVIO, ANTHONY M.
To: MOTOROLA, INC.
Reel/Frame 026446/0647 →