Patent Assignment
Reel/Frame 026605/0657
Assignment of Assignor's Interest
Recorded: 2011-07-18
Pages: 3
Assignors
SATOU, EIICHI
Executed: 2011-05-16
NOBE, SHIGERU
Executed: 2011-05-16
OOTA, MUNEHIRO
Executed: 2011-05-16
HANANO, MASAYUKI
Executed: 2011-05-16
YOSHIKAWA, SHIGERU
Executed: 2011-05-16
Assignee
HITACHI CHEMICAL COMPANY, LTD.
1-1, NISHI-SHINJUKU 2-CHOME, SHINJUKU-KU, TOKYO, 163-0449, JAPAN
Covered Property
(1)
Polishing Solution for Cmp and Polishing Method Using the Polishing Solution
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Address for Assignee
Oct 21, 2013
From: HITACHI CHEMICAL COMPANY, LTD.
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 031447/0455 →
Corrective Assignment to Correct the Application Number Previously Recorded on Reel 031447 Frame 0455. Assignor(S) Hereby Confirms the Application Number Is 13102486.
Nov 15, 2013
From: HITACHI CHEMICAL COMPANY, LTD.
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 031657/0210 →
Change of Name
Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name
Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →