Patent Assignment
Reel/Frame 031657/0210
Corrective Assignment to Correct the Application Number Previously Recorded on Reel 031447 Frame 0455. Assignor(S) Hereby Confirms the Application Number Is 13102486.
Recorded: 2013-11-15
Pages: 8
Assignor
HITACHI CHEMICAL COMPANY, LTD.
Executed: 2013-01-07
Assignee
HITACHI CHEMICAL COMPANY, LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Polishing Solution for Cmp and Polishing Method Using the Polishing Solution
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jul 18, 2011
From: SATOU, EIICHI; NOBE, SHIGERU; OOTA, MUNEHIRO; HANANO, MASAYUKI
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 026605/0657 →
Change of Address for Assignee
Oct 21, 2013
From: HITACHI CHEMICAL COMPANY, LTD.
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 031447/0455 →
Change of Name
Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name
Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →