IP Library Assignment 026629/0194
Patent Assignment
Reel/Frame 026629/0194

Assignment of Assignor's Interest

Recorded: 2011-07-21 Pages: 6
Assignors
PURAYATH, VINOD R.
Executed: 2011-07-15
KAI, JAMES K.
Executed: 2011-07-18
PACHAMUTHU, JAYAVEL
Executed: 2011-07-15
LIANG, JARRETT JUN
Executed: 2011-07-18
MATAMIS, GEORGE
Executed: 2011-07-15
Assignee
SANDISK TECHNOLOGIES, INC.
TWO LEGACY TOWN CENTER, 6900 NORTH DALLAS PARKWAY, PLANO, TEXAS, 79024
Covered Property (1)
Copper Interconnects Separated by Air Gaps and Method of Making Thereof
Patent: 8,575,000 →
Application: 13/186,094 →
Publication: US 2013/0020708
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name May 25, 2016
From: SANDISK TECHNOLOGIES INC
To: SANDISK TECHNOLOGIES LLC
Reel/Frame 038807/0850 →
Assignment of Assignor's Interest Dec 31, 2024
From: SANDISK TECHNOLOGIES LLC
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 069796/0423 →
Assignment of Assignor's Interest Apr 8, 2025
From: SANDISK TECHNOLOGIES, INC.
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 070778/0175 →