Patent Assignment
Reel/Frame 026640/0426
Assignment of Assignor's Interest
Recorded: 2011-07-25
Pages: 4
Assignors
SATOU, EIICHI
Executed: 2011-06-06
OOTA, MUNEHIRO
Executed: 2011-06-14
CHINONE, KANSHI
Executed: 2011-06-14
NOBE, SHIGERU
Executed: 2011-06-20
ENOMOTO, KAZUHIRO
Executed: 2011-06-20
KIMURA, TADAHIRO
Executed: 2011-06-08
FUKASAWA, MASATO
Executed: 2011-06-08
HABIRO, MASANOBU
Executed: 2011-06-10
HOSHI, YOUSUKE
Executed: 2011-06-17
Assignee
HITACHI CHEMICAL COMPANY, LTD.
1-1, NISHI-SHINJUKU 2-CHOME, SHINJUKU-KU, TOKYO, 163-0449, JAPAN
Covered Property
(1)
Polishing Solution for Cmp and Polishing Method Using the Polishing Solution
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Address
May 13, 2015
From: HITACHI CHEMICAL COMPANY, LTD.
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 035655/0064 →
Change of Name
Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name
Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →