IP Library Assignment 035655/0064
Patent Assignment
Reel/Frame 035655/0064

Change of Address

Recorded: 2015-05-13 Pages: 6
Assignor
HITACHI CHEMICAL COMPANY, LTD.
Executed: 2013-01-07
Assignee
HITACHI CHEMICAL COMPANY, LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, JAPAN
Covered Property (1)
Polishing Solution for Cmp and Polishing Method Using the Polishing Solution
Patent: 9,022,834 →
Application: 13/139,117 →
Publication: US 2011/0275285
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 25, 2011
From: SATOU, EIICHI; OOTA, MUNEHIRO; CHINONE, KANSHI; NOBE, SHIGERU
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 026640/0426 →
Change of Name Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →