IP Library › Assignment 026680/0722
Patent Assignment
Reel/Frame 026680/0722

Assignment of Assignor's Interest

Recorded: 2011-08-01 Pages: 3
Assignors
MEYER, THORSTEN
Executed: 2007-08-12
HEDLER, HARRY
Executed: 2007-08-31
BRUNNBAUER, MARKUS
Executed: 2007-08-27
Assignee
INFINEON TECHNOLOGIES AG
AM CAMPEON 1-12, NEUBIBERG, 85579, GERMANY
Covered Property (1)
Method for Producing Chip Packages, and Chip Package Produced in This Way
Patent: 8,487,448 →
Application: 13/195,333 →
Publication: US 2011/0285030
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 1, 2022
From: INFINEON TECHNOLOGIES AG
To: INTEL MOBILE COMMUNICATIONS TECHNOLOGY GMBH
Reel/Frame 060418/0660 →
Assignment of Assignor's Interest Jul 8, 2022
From: INTEL MOBILE COMMUNICATIONS TECHNOLOGY GMBH
To: INTEL MOBILE COMMUNICATIONS GMBH
Reel/Frame 060616/0682 →
Change of Name Jul 22, 2022
From: INTEL MOBILE COMMUNICATIONS GMBH
To: INTEL DEUTSCHLAND GMBH
Reel/Frame 060882/0268 →
Assignment of Assignor's Interest Aug 29, 2022
From: INTEL DEUTSCHLAND GMBH
To: INTEL CORPORATION
Reel/Frame 061356/0001 →