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Patent Assignment
Reel/Frame 060616/0682

Assignment of Assignor's Interest

Recorded: 2022-07-08 Pages: 24
Assignor
Assignee
INTEL MOBILE COMMUNICATIONS GMBH
AM CAMPEON 10-12, NEUBIBERG, 85579, GERMANY
Covered Property (1)
Method for Producing Chip Packages, and Chip Package Produced in This Way
Patent: 8,487,448 →
Application: 13/195,333 →
Publication: US 2011/0285030
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 1, 2011
From: MEYER, THORSTEN; HEDLER, HARRY; BRUNNBAUER, MARKUS
To: INFINEON TECHNOLOGIES AG
Reel/Frame 026680/0722 →
Assignment of Assignor's Interest Jul 1, 2022
From: INFINEON TECHNOLOGIES AG
To: INTEL MOBILE COMMUNICATIONS TECHNOLOGY GMBH
Reel/Frame 060418/0660 →
Change of Name Jul 22, 2022
From: INTEL MOBILE COMMUNICATIONS GMBH
To: INTEL DEUTSCHLAND GMBH
Reel/Frame 060882/0268 →
Assignment of Assignor's Interest Aug 29, 2022
From: INTEL DEUTSCHLAND GMBH
To: INTEL CORPORATION
Reel/Frame 061356/0001 →