Patent Assignment
Reel/Frame 026718/0756
Assignment of Assignor's Interest
Recorded: 2011-08-09
Pages: 3
Assignors
LI, CHANG-JE
Executed: 2011-06-16
KO, MEI-CHUN
Executed: 2011-06-16
CHU, ERH-JEN
Executed: 2011-06-16
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Modulized Full Operation Junction Ultra High Voltage (UHV) Device
Application:
13/153,087 →
Publication:
US 2012/0306391
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Apr 3, 2012
From: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
To: TSMC SOLID STATE LIGHTING LTD.
Reel/Frame 027982/0191 →
Merger
Mar 26, 2016
From: CHIP STAR LTD.
To: EPISTAR CORPORATION
Reel/Frame 038107/0962 →
Change of Name
Mar 26, 2016
From: TSMC SOLID STATE LIGHTING LTD.
To: CHIP STAR LTD.
Reel/Frame 038263/0076 →