IP Library › Assignment 027982/0191
Patent Assignment
Reel/Frame 027982/0191

Assignment of Assignor's Interest

Recorded: 2012-04-03 Pages: 3
Assignor
Assignee
TSMC SOLID STATE LIGHTING LTD.
9, LI-HSIN 4TH ROAD, HSINCHU SCIENCE PARK, HSINCHU, 300-77, TAIWAN
Covered Property (1)
Modulized Full Operation Junction Ultra High Voltage (UHV) Device
Application: 13/153,087 →
Publication: US 2012/0306391
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 9, 2011
From: LI, CHANG-JE; KO, MEI-CHUN; CHU, ERH-JEN
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 026718/0756 →
Merger Mar 26, 2016
From: CHIP STAR LTD.
To: EPISTAR CORPORATION
Reel/Frame 038107/0962 →
Change of Name Mar 26, 2016
From: TSMC SOLID STATE LIGHTING LTD.
To: CHIP STAR LTD.
Reel/Frame 038263/0076 →