Patent Assignment
Reel/Frame 026730/0352
Assignment of Assignor's Interest
Recorded: 2011-08-10
Pages: 6
Assignors
LEI, WEI-SHENG
Executed: 2011-06-24
EATON, BRAD
Executed: 2011-06-27
YALAMANCHILI, MADHAVA RAO
Executed: 2011-06-27
SINGH, SARAVJEET
Executed: 2011-06-27
KUMAR, AJAY
Executed: 2011-06-27
HOLDEN, JAMES M.
Executed: 2011-06-27
Assignee
APPLIED MATERIALS, INC.
3050 BOWERS AVENUE, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Wafer Dicing Using Femtosecond-Based Laser and Plasma Etch