Assignment of Assignor's Interest

Recorded: 2011-08-10 Pages: 3

Assignor

XIAO, JUN-YI

Executed: 2011-08-04

Assignees

AMBIT MICROSYSTEMS (ZHONGSHAN) LTD.,ZHONGSHAN TORCH HI-TECH DEVELOPMENT ZONE, ZHONGSHAN CITY, GUANGDONG PROVINCE, CHINA

66,CHUNG SHAN ROAD, TU-CHENG, NEW TAIPEI, TAIWAN

Covered Property (1)

Package Structure with Electronic Component and Method for Manufacturing Same

Patent: 8,625,297 →

Application: 13/206,532 →

Publication: US 2013/0021772

Related Assignments (2)

Other recorded transfers of the patent in this record — the chain of ownership.