IP Library › Assignment 030400/0109
Patent Assignment
Reel/Frame 030400/0109

Assignment of Assignor's Interest

Recorded: 2013-05-13 Pages: 3
Assignor
Assignee
AMBIT MICROSYSTEMS (ZHONGSHAN) LTD.
AMBIT MICROSYSTEMS (ZHONGSHAN) LTD.,ZHONGSHAN TORCH HI-TECH DEVELOPMENT ZONE, ZHONGSHAN, CHINA
Covered Property (1)
Package Structure with Electronic Component and Method for Manufacturing Same
Patent: 8,625,297 →
Application: 13/206,532 →
Publication: US 2013/0021772
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 10, 2011
From: XIAO, JUN-YI
To: AMBIT MICROSYSTEMS (ZHONGSHAN) LTD.; HON HAI PRECISION INDUSTRY CO., LTD.
Reel/Frame 026731/0172 →
Change of Name Jul 23, 2014
From: AMBIT MICROSYSTEMS (ZHONGSHAN) LTD.
To: SHUNSIN TECHNOLOGY (ZHONG SHAN) LIMITED
Reel/Frame 033394/0658 →