Patent Assignment
Reel/Frame 026756/0242
Assignment of Assignor's Interest
Recorded: 2011-08-16
Pages: 2
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416 MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Method of Manufacturing Semiconductor Package