IP Library › Assignment 026770/0417
Patent Assignment
Reel/Frame 026770/0417

Assignment of Assignor's Interest

Recorded: 2011-08-18 Pages: 5
Assignors
SWAMINATHAN, RAJASEKARAN
Executed: 2009-04-21
ARANA, LEONEL
Executed: 2009-04-24
TOMITA, YOSHIHIRO
Executed: 2009-04-30
KANAOKA, YOSUKE
Executed: 2009-04-27
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95052
Covered Property (1)
Forming sacrificial composite materials for package-on-package architectures and structures formed thereby
Patent: 9,006,887 →
Application: 12/380,957 →
Publication: US 2010/0224993
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 18, 2026
From: INTEL CORPORATION
To: INTEL FOUNDRY IP LLC
Reel/Frame 076065/0923 →