Patent Assignment
Reel/Frame 076065/0923
Assignment of Assignor's Interest
Recorded: 2026-09-18
Pages: 4
Assignor
INTEL CORPORATION
Executed: 2026-04-10
Assignee
INTEL FOUNDRY IP LLC
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Properties
(40)
Stressed Semiconductor Using Carbon and Method for Producing the Same
Integrated Capacitors in Package-Level Structures, Processes of Making Same, and Systems Containing Same
Barrier Layer for Fine-Pitch Mask-Based Substrate Bumping
Package Level Integration of Antenna and Rf Front-End Module
Multiband Antenna Array Using Electromagnetic Bandgap Structures
Flexible Joint Methodology to Attach a Die on an Organic Substrate
Dual Layer Dielectric Stack for Microelectronics Having Thick Metal Lines
Transistor, Method of Manufacturing Same, Etchant for Use During Manufacture of Same, and System Containing Same
Nanotube Based Vapor Chamber for Die Level Cooling
Skived Electrical Contact for Connecting an Ic Device to a Circuit Board and Method of Making a Contact by Skiving
Flip-Chip Package and Method of Forming Thereof
Nanolithographic Method of Manufacturing an Embedded Passive Device for a Microelectronic Application, and Microelectronic Device Containing Same
Method of Manufacturing a Substrate for a Microelectronic Device, and Substrate Formed Thereby
Cmos Device and Method of Manufacturing Same
Methods of Channel Stress Engineering and Structures Formed Thereby
Method and Core Materials for Semiconductor Packaging
Method and Core Materials for Semiconductor Packaging
Tunnel Field Effect Transistor and Method of Manufacturing Same
Forming sacrificial composite materials for package-on-package architectures and structures formed thereby
In-Pakage Microelectronic Apparatus, and Methods of Using Same
Method and Apparatus for Determining Within-Die and Across-Die Variation of Analog Circuits
Microelectronic Package and Method of Manufacturing Same
Microelectronic Package and Method of Manufacturing Same
Magnetic Microinductors for Integrated Circuit Packaging
Package for a Microelectronic Die, Microelectronic Assembly Containing Same, Microelectronic System, and Method of Reducing Die Stress in a Microelectronic Package
Through-Silicon via Resonators in Chip Packages and Methods of Assembling Same
Photonic Package Architecture
Chip with Encapsulated Sides and Exposed Surface
Method of Manufacturing a Semiconductor Device Including Removing a Relief Layer from Back Surface of Semiconductor Chip
Routing Design for High Speed Input/Output Links
Embedded Structures for Package-on-Package Architecture
Contact Protection for Integrated Circuit Device Loading
Methods and Apparatus for Modeling and Simulating Spintronic Integrated Circuits
Carrier Sheet with Adhesive Film and Method for Producing Semiconductor Devices Using the Carrier Sheet with Adhesive Film
Component and Method for Producing a Component
Method and Apparatus for Efficient Pre-Silicon Debug
Methods and Devices for Securing and Transporting Singulated Die in High Volume Manufacturing
Methods and Devices for Securing and Transporting Singulated Die in High Volume Manufacturing
Digital Distributed Antenna System
Integrated 1T1R Rram Memory Cell
Related Assignments
(14)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Feb 14, 2005
From: RAVI, KRAMADHATI V.; DOYLE, BRIAN S.
To: INTEL CORPORATION
Reel/Frame 016288/0600 →
Assignment of Assignor's Interest
Dec 26, 2007
From: TANG, JOHN; ZENG, XIANG YIN; HE, JIANGQI; HAI, DING
To: INTEL CORPORATION
Reel/Frame 020298/0401 →
Assignment of Assignor's Interest
Aug 4, 2008
From: ZENG, XIANG YIN; HE, JIANGQI; ZHENG, GUIZHEN
To: INTEL CORPORATION
Reel/Frame 021334/0898 →
Assignment of Assignor's Interest
Nov 19, 2008
From: LEE, KEVIN J.; JOSHI, SUBHASH
To: INTEL CORPORATION
Reel/Frame 021860/0915 →
Assignment of Assignor's Interest
Mar 16, 2009
From: LI, YONGGANG; ALUR, AMRUTHAVALLI P.; BALARAMAN, DEVARAJAN; QI, XIWANG
To: INTEL CORPORATION
Reel/Frame 022398/0338 →
Assignment of Assignor's Interest
Apr 20, 2009
From: VADAKKANMARUVEEDU, UNNIKRISHNAN; CHRYSLER, GREGORY MARTIN; MAVEETY, JAMES G.
To: INTEL CORPORATION
Reel/Frame 022569/0276 →
Assignment of Assignor's Interest
May 15, 2009
From: CHIU, CHIA-PIN
To: INTEL CORPORATION
Reel/Frame 022688/0330 →
Assignment of Assignor's Interest
May 18, 2009
From: JOMAA, HOUSSAM; ALUR, AMRUTHAVALLI P.; SENEVIRATNE, DILAN
To: INTEL CORPORATION
Reel/Frame 022698/0853 →
Assignment of Assignor's Interest
May 18, 2009
From: SELL, BERNHARD; MURTHY, ANAND; LIU, MARK; AUBERTINE, DANIEL B.
To: INTEL CORPORATION
Reel/Frame 022698/0828 →
Assignment of Assignor's Interest
Jul 10, 2009
From: RACHMADY, WILLY; RAMACHANDRARAO, VIJAY; GOLONZKA, OLEG; FAJARDO, ARNEL M.
To: INTEL CORPORATION
Reel/Frame 022941/0873 →
Assignment of Assignor's Interest
Jul 10, 2009
From: NALLA, RAVI K.; TSAU, CHRISTINE H.; HLAD, MARK S.
To: INTEL CORPORATION
Reel/Frame 022941/0840 →
Assignment of Assignor's Interest
Aug 24, 2009
From: SANKMAN, BOB
To: INTEL CORPORATION
Reel/Frame 023139/0697 →
Assignment of Assignor's Interest
Oct 3, 2014
From: OGATA, KAZUO; FUKUO, TSUYOSHI; ISHIYAMA, SEIJI; KOH, TETSUHIDE
To: INTEL CORPORATION
Reel/Frame 033882/0465 →
Assignment of Assignor's Interest
Oct 30, 2014
From: KAMGAING, TELESPHOR
To: INTEL CORPORATION
Reel/Frame 034066/0070 →