Patent Assignment
Reel/Frame 023139/0697
Assignment of Assignor's Interest
Recorded: 2009-08-24
Pages: 3
Assignor
SANKMAN, BOB
Executed: 2008-02-08
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BLVD, SANTA CLARA, CALIFORNIA, 95052
Covered Property
(1)
Flip-Chip Package and Method of Forming Thereof
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.