Patent Assignment
Reel/Frame 026774/0127
Assignment of Assignor's Interest
Recorded: 2011-08-18
Pages: 4
Assignors
HUANG, GIN-CHEN
Executed: 2011-08-11
HSIAO, TSAI-FU
Executed: 2011-08-11
JIANG, CHING-HONG
Executed: 2011-08-12
CHEN, NENG-KUO
Executed: 2011-08-11
LUAN, HONGFA
Executed: 2011-08-11
SUN, SEY-PING
Executed: 2011-08-12
WANN, CLEMENT HSINGJEN
Executed: 2011-08-17
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77 R.O.C., TAIWAN
Covered Property
(1)
Semiconductor Device Manufacturing Methods and Methods of Forming Insulating Material Layers