IP Library › Assignment 026778/0990
Patent Assignment
Reel/Frame 026778/0990

Assignment of Assignor's Interest

Recorded: 2011-08-19 Pages: 2
Assignor
LIN, KENG HUNG
Executed: 2011-08-19
Assignee
ADVANCED ANALOGIC TECHNOLOGIES (HONG KONG) LIMITED
NO. 1 SCIENCE MUSEUM ROAD, UNIT 12, 17/F NORTH TOWER, HONG KONG, CHINA
Covered Property (1)
Multi-Die Semiconductor Package With One Or More Embedded Die Pads
Patent: 8,513,787 →
Application: 13/210,841 →
Publication: US 2013/0043574
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 19, 2011
From: WILLIAMS, RICHARD K.
To: ADVANCED ANALOGIC TECHNOLOGIES, INC.
Reel/Frame 026778/0385 →
Assignment of Assignor's Interest May 8, 2025
From: ADVANCED ANALOGIC TECHNOLOGIES INCORPORATED
To: SKYWORKS SOLUTIONS, INC.
Reel/Frame 071234/0320 →