Multi-die semiconductor package with one or more embedded die pads
View Patent ↗To avoid shorts between adjacent die pads in mounting a multi-die semiconductor package to a printed circuit board (PCB), one of the die pads is embedded in the polymer capsule, while the other die pad is exposed at the bottom of the package to provide a thermal escape path to the PCB. This arrangement is particularly useful when one of the dice in a multi-die package generates more heat than another die in the package.
1. A semiconductor package comprising:
at least two semiconductor dice, the at least two semiconductor dice comprising a first semiconductor die and a second semiconductor die;
first and second die pads, the first die pad being thicker than the second die pad, the first die pad being electrically insulated from the second die pad, each of the first and second die pads having a mounting surface and an opposite surface, the first semiconductor die being mounted on the mounting surface of the first die pad, the second semiconductor die being mounted on the mounting surface of the second die pad, the mounting surface of the first die pad being coplanar with the mounting surface of the second die pad; and
a capsule encasing the first and second semiconductor dice, the opposite surface of the first die pad being exposed at a surface of the capsule, the opposite surface of the second die pad being embedded in the capsule.
2. The semiconductor package of claim 1 wherein the semiconductor package comprises a no-lead semiconductor package.
3. The semiconductor package of claim 2 comprising a plurality of contacts.
4. The semiconductor package of claim 3 wherein each of the contacts is exposed at the surface of the capsule and wherein at least one of the contacts comprises an integral extension of the second die pad.
5. The semiconductor package of claim 4 wherein each of the contacts has an exposed bottom surface and an embedded bottom surface, the exposed bottom surface of each contact being exposed at the surface of the capsule.
6. The semiconductor package of claim 5 wherein the embedded bottom surface of each of the contacts is coplanar with the opposite surface of the second die pad.
7. The semiconductor package of claim 6 wherein the first die pad comprises a peripheral shelf, a bottom surface of the peripheral shelf being embedded in the capsule.
8. The semiconductor package of claim 7 wherein a bottom surface of the peripheral shelf is coplanar with the opposite surface of the second die pad.
9. The semiconductor package of claim 1 wherein the package comprises a plurality of leads, each of the leads extending laterally from a side edge of the capsule.
10. The semiconductor package of claim 1 wherein the first semiconductor die comprises a power device and the second semiconductor die comprises a control device.
11. The semiconductor package of claim 1 wherein a distance between the mounting surface and the opposite surface of the first die pad is greater than a distance between the mounting surface and the opposite surface of the second die pad.
12. The semiconductor package of claim 1 wherein the surface of the capsule is planar.
13. The semiconductor package of claim 1 wherein the surface of the capsule comprises a bottom surface of the capsule.