Patent Assignment
Reel/Frame 026778/0385
Assignment of Assignor's Interest
Recorded: 2011-08-19
Pages: 5
Assignor
WILLIAMS, RICHARD K.
Executed: 2011-08-03
Assignee
ADVANCED ANALOGIC TECHNOLOGIES, INC.
3230 SCOTT BLVD., SANTA CLARA, CALIFORNIA, 95054
Covered Properties
(4)
Solder Bump Bonding In Semiconductor Package Using Solder Balls Having High-Temperature Cores
Application:
13/210,152 →
Publication:
US 2013/0043573
Semiconductor Package Containing Silicon-on-Insulator Die Mounted in Bump-on-Leadframe Manner to Provide Low Thermal Resistance
Integrated Circuit Die with Low Thermal Resistance
Multi-Die Semiconductor Package With One Or More Embedded Die Pads
Related Assignments
(4)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Aug 19, 2011
From: LIN, KENG HUNG
To: ADVANCED ANALOGIC TECHNOLOGIES (HONG KONG) LIMITED
Reel/Frame 026778/0873 →
Assignment of Assignor's Interest
Aug 19, 2011
From: LIN, KENG HUNG
To: ADVANCED ANALOGIC TECHNOLOGIES (HONG KONG) LIMITED
Reel/Frame 026778/0990 →
Change of Name
Dec 29, 2015
From: ADVANCED ANALOGIC TECHNOLOGIES (HONG KONG) LIMITED
To: SKYWORKS SOLUTIONS (HONG KONG) LIMITED
Reel/Frame 037394/0920 →
Assignment of Assignor's Interest
May 8, 2025
From: ADVANCED ANALOGIC TECHNOLOGIES INCORPORATED
To: SKYWORKS SOLUTIONS, INC.
Reel/Frame 071234/0320 →