IP Library › Assignment 037394/0920
Patent Assignment
Reel/Frame 037394/0920

Change of Name

Recorded: 2015-12-29 Pages: 2
Assignor
Assignee
SKYWORKS SOLUTIONS (HONG KONG) LIMITED
UNIT 12, 17/F NORTH TOWER, CONCORDIA PLAZA, N 1 SCIENCE MUSEUM ROAD, TSIMSHATSUI, KOWLOON, HONG KONG, CHINA
Covered Property (1)
Integrated Circuit Die with Low Thermal Resistance
Patent: 9,305,859 →
Application: 13/210,764 →
Publication: US 2013/0043572
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 19, 2011
From: WILLIAMS, RICHARD K.
To: ADVANCED ANALOGIC TECHNOLOGIES, INC.
Reel/Frame 026778/0385 →
Assignment of Assignor's Interest Aug 19, 2011
From: LIN, KENG HUNG
To: ADVANCED ANALOGIC TECHNOLOGIES (HONG KONG) LIMITED
Reel/Frame 026778/0873 →
Assignment of Assignor's Interest May 8, 2025
From: ADVANCED ANALOGIC TECHNOLOGIES INCORPORATED
To: SKYWORKS SOLUTIONS, INC.
Reel/Frame 071234/0320 →