Patent Assignment
Reel/Frame 026778/0873
Assignment of Assignor's Interest
Recorded: 2011-08-19
Pages: 3
Assignor
LIN, KENG HUNG
Executed: 2011-07-29
Assignee
ADVANCED ANALOGIC TECHNOLOGIES (HONG KONG) LIMITED
NO. 1 SCIENCE MUSEUM ROAD, UNIT 12, 17/F NORTH TOWER, HONG KONG, CHINA
Covered Properties
(2)
Solder Bump Bonding In Semiconductor Package Using Solder Balls Having High-Temperature Cores
Application:
13/210,152 →
Publication:
US 2013/0043573
Integrated Circuit Die with Low Thermal Resistance
Related Assignments
(3)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Aug 19, 2011
From: WILLIAMS, RICHARD K.
To: ADVANCED ANALOGIC TECHNOLOGIES, INC.
Reel/Frame 026778/0385 →
Change of Name
Dec 29, 2015
From: ADVANCED ANALOGIC TECHNOLOGIES (HONG KONG) LIMITED
To: SKYWORKS SOLUTIONS (HONG KONG) LIMITED
Reel/Frame 037394/0920 →
Assignment of Assignor's Interest
May 8, 2025
From: ADVANCED ANALOGIC TECHNOLOGIES INCORPORATED
To: SKYWORKS SOLUTIONS, INC.
Reel/Frame 071234/0320 →