Patent Assignment
Reel/Frame 026784/0491
Assignment of Assignor's Interest
Recorded: 2011-08-22
Pages: 4
Assignors
BOTHRA, SUBHAS
Executed: 2011-08-19
SKALA, STEVEN L.
Executed: 2011-06-26
DEMUIZON, EMMANUEL
Executed: 2011-07-04
Assignee
PHILIPS SEMICONDUCTORS, INC.
1251 AVENUE OF THE AMERICAS, NEW YORK, NEW YORK, 10020
Covered Property
(1)
Pad Metallization Over Active Circuitry
Patent:
6,261,939 →
Application:
09/472,384 →
Related Assignments
(7)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jul 18, 2009
From: PHILIPS SEMICONDUCTORS INC.
To: NXP B.V.
Reel/Frame 022973/0239 →
Change of Name
Jul 18, 2009
From: PHILIPS SEMICONDUCTORS VLSI INC.
To: PHILIPS SEMICONDUCTORS INC.
Reel/Frame 022973/0254 →
Change of Name
Jul 18, 2009
From: VLSI TECHNOLOGY, INC.
To: PHILIPS SEMICONDUCTORS VLSI INC.
Reel/Frame 022973/0248 →
Corrective Assignment to Correct the Assignment's Effective Date (It Is Nunc Pro Tunc) and the Patent's Recited Filing Date as Previously Recorded on Reel 026784 Frame 0491. Assignor(S) Hereby Confirms the Nunc Pro Tunc Assignment's Effective Date Is 01/11/2000 and the Patent's Filing Date Is 12/23/1999.
Nov 7, 2011
From: BOTHRA, SUBHAS; SKALA, STEVEN L.; DE MUIZON, EMMANUEL
To: PHILIPS SEMICONDUCTORS, INC.
Reel/Frame 027181/0914 →
Assignment of Assignor's Interest
Dec 12, 2011
From: NXP SEMICONDUCTORS N.V., ON BEHALF OF ITSELF AND ITS SUBSIDIARIES, INCLUDING NXP B.V.
To: INVENSAS CORPORATION
Reel/Frame 027405/0795 →
Security Interest
Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Release of Security Interest
Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →