IP Library › Assignment 026784/0749
Patent Assignment
Reel/Frame 026784/0749

Assignment of Assignor's Interest

Recorded: 2011-08-22 Pages: 5
Assignors
TSAI, SHUANG-JI
Executed: 2011-05-24
YAUNG, DUN-NIAN
Executed: 2011-05-24
LIU, JEN-CHENG
Executed: 2011-05-24
WANG, WEN-DE
Executed: 2011-05-24
LIN, JENG-SHYAN
Executed: 2011-05-24
HO, CHENG-YING
Executed: 2011-05-24
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property (1)
Semiconductor Device Having a Bonding Pad and Shield Structure of Different Thickness
Patent: 8,710,612 →
Application: 13/112,828 →
Publication: US 2012/0292728
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 5, 2024
From: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
To: PARABELLUM STRATEGIC OPPORTUNITIES FUND LLC
Reel/Frame 068326/0474 →