Semiconductor device having a bonding pad and shield structure of different thickness
A semiconductor device includes a device substrate having a front side and a back side corresponding to a front side and a back side of the semiconductor device, a metal feature formed on the front side of the device substrate, a bonding pad disposed on the back side of the semiconductor device and in electrical communication with the metal feature, and a shield structure disposed on the back side of the device substrate in which the shield structure and the bonding pad have different thicknesses relative to each other.
1. A semiconductor device, comprising:
a device substrate having a front side and a back side corresponding to a front side and a back side of the semiconductor device;
a metal feature formed on the front side of the device substrate;
a bonding pad disposed on the back side of the semiconductor device and in electrical communication with the metal feature;
a shield structure disposed on the back side of the device substrate in which the shield structure and the bonding pad have different thicknesses relative to each other;
a first passivation layer formed over the shield structure and directly over the bonding pad; and
an insulating layer, wherein the shield structure is formed over the insulating layer, and wherein the shield structure does not contact the device substrate.
2. The semiconductor device of claim 1 , further comprising:
a radiation-sensing region disposed in the device substrate, the radiation-sensing region being operable to sense radiation projected toward the radiation-sensing region from the back side of the device substrate;
a second passivation layer disposed on the front side of the semiconductor device;
a carrier substrate bonded to the second passivation layer; and
a first buffer layer disposed on the back side of the device substrate.
3. The semiconductor device of claim 2 , further comprising:
a second buffer layer disposed over the back side of the device substrate, wherein the second buffer layer is interposed between the first buffer layer and the first passivation layer.
4. The semiconductor device of claim 1 , wherein the bonding pad is thicker than the shield structure.
5. The semiconductor device of claim 1 , wherein the bonding pad and the shield structure include a material selected from the group consisting of aluminum, copper, aluminum-copper, titanium, tantalum, titanium nitride, tantalum nitride, and tungsten.
6. The semiconductor device of claim 1 , wherein the shield structure and the bonding pad comprise different materials.
7. A semiconductor device, comprising:
a substrate having a bonding region and a non-bonding region and having a front side and a back side corresponding to a front side and a back side of the semiconductor device;
a metal feature disposed on the front side of the substrate;
a first conductive material disposed within a trench on the back side of the semiconductor device in the bonding region, wherein the first conductive material is in electrical communication with the metal feature, and wherein the first conductive material has a first thickness;
a second conductive material disposed on the back side of the substrate in the non-bonding region, in which the second conductive material has a second thickness, and in which the first thickness is different from the second thickness;
a first passivation layer formed directly over the first conductive material and over the second conductive material; and
an insulating layer, wherein the second conductive material is formed over the insulating layer, and wherein the second conductive material does not contact the substrate.
8. The semiconductor device of claim 7 , wherein the semiconductor device comprises a back-side illuminated image sensor device.
9. The semiconductor device of claim 7 , further comprising:
a second passivation layer disposed on the front side of the substrate, wherein the second passivation layer includes a material selected from the group consisting of silicon oxide and silicon nitride.
10. The semiconductor device of claim 7 , further comprising a radiation-sensing region in the non-bonding region and having at least one image sensor.
11. The semiconductor device of claim 7 , in which the first and second conductive materials each include a material selected from the group consisting of aluminum, copper, aluminum-copper, titanium, tantalum, titanium nitride, tantalum nitride, and tungsten.
12. The semiconductor device of claim 7 wherein the first and second conductive materials comprise different materials.