Patent Assignment
Reel/Frame 026830/0419
Assignment of Assignor's Interest
Recorded: 2011-08-30
Pages: 3
Assignor
SADAKA, MARIAM
Executed: 2011-08-25
Assignee
S.O.I.TEC SILICON ON INSULATOR TECHNOLOGIES
CHEMIN DES FRANQUES, PARC TECHNOLOGIQUE DES FONTAINES, BERNIN, 38190, FRANCE
Covered Property
(1)
Bonding Surfaces for Direct Bonding of Semiconductor Structures
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Feb 28, 2012
From: S.O.I. TEC SILICON ON INSULATOR TECHNOLOGIES; CHEMIN DES FRANQUES; PARC TECHNOLOGIES DES FONTAINES; BERNIN. FRANCE 38190
To: SOITEC
Reel/Frame 028138/0895 →
Assignment of Assignor's Interest
Feb 4, 2020
From: SOITEC
To: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
Reel/Frame 051707/0878 →