Patent Assignment
Reel/Frame 026839/0740
Assignment of Assignor's Interest
Recorded: 2011-08-31
Pages: 5
Assignee
AEROFLEX COLORADO SPRINGS INC.
4350 CENTENNIAL BLVD., COLORADO SPRINGS, COLORADO, 80907-3486
Covered Property
(1)
Wafer Structure for Electronic Integrated Circuit Manufacturing
Related Assignments
(7)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Agreement
May 30, 2013
From: AEROFLEX INCORPORATED; AEROFLEX PLAINVIEW, INC.; AEROFLEX COLORADO SPRINGS, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 030514/0343 →
Release of Security Interest
Mar 2, 2021
From: JPMORGAN CHASE BANK, N.A.
To: AEROFLEX INCORPORATED; AEROFLEX/WEINSCHEL, INC.; AEROFLEX COLORADO SPRINGS, INC.; AEROFLEX MICROELECTRONIC SOLUTIONS, INC.
Reel/Frame 055461/0294 →
Change of Name
Apr 7, 2021
From: AEROFLEX COLORADO SPRINGS, INC.
To: COBHAM COLORADO SPRINGS INC.
Reel/Frame 055847/0958 →
Entity Conversion
Aug 22, 2022
From: COBHAM COLORADO SPRINGS INC.
To: CAES COLORADO SPRINGS LLC
Reel/Frame 061299/0532 →
Entity Conversion
Aug 22, 2022
From: COBHAM COLORADO SPRINGS INC.
To: CAES COLORADO SPRINGS LLC
Reel/Frame 061299/0490 →
Security Interest
Jan 9, 2023
From: CAES COLORADO SPRINGS LLC; COBHAM ADVANCED ELECTRONIC SOLUTIONS INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 062337/0939 →
Change of Name
Aug 5, 2024
From: CAES COLORADO SPRINGS LLC
To: FRONTGRADE COLORADO SPRINGS LLC
Reel/Frame 068326/0038 →