Patent Assignment
Reel/Frame 061299/0532
Entity Conversion
Recorded: 2022-08-22
Pages: 5
Assignor
COBHAM COLORADO SPRINGS INC.
Executed: 2021-12-21
Assignee
CAES COLORADO SPRINGS LLC
2121 CRYSTAL DRIVE, SUITE 800, ARLINGTON, VIRGINIA, 22202
Covered Properties
(57)
Radiation-Hardened Programmable Device
Error Correcting Latch
Patent:
6,573,774 →
Application:
10/107,293 →
Radiation Hardening Method for Shallow Trench Isolation in Cmos
Patent:
6,890,832 →
Application:
10/292,787 →
Error Correcting Latch
Error Correcting Latch
Total Ionizing Dose Suppression Transistor Architecture
Temperature Insensitive Reference Circuit for Use in a Voltage Detection Circuit
Set and Segr Resistant Delay Cell and Delay Line for Power-on Reset Circuit Applications
Radiation Hardened Logic Circuit
High Speed Voltage Translator Circuit
Current Comparator Using Wide Swing Current Mirrors
Autodetect Feature for a Spacewire Application
Two Component Photodiode Detector
Data Throttling Circuit and Method for a Spacewire Application
Cross-Talk and Back Side Shielding in a Front Side Illuminated Photo Detector Diode Array
Total Ionizing Dose Suppression Transistor Architecture
Energy Sensitive Direct Conversion Radiation Detector
Radiation Tolerant Circuit for Minimizing the Dependence of a Precision Voltage Reference from Ground Bounce and Signal Glitch
Continuous-Time Circuit and Method for Capacitance Equalization Based on Electrically Tunable Voltage Pre-Distortion of a C-V Characteristic
Electrically Tunable Continuous-Time Circuit and Method for Compensating a Polynomial Voltage-Dependent Characteristic of Capacitance
Tungsten Stiffener for Flexible Substrate Assembly
Amplitude-Stabilized Odd Order Pre-Distortion Circuit
Amplitude-Stabilized Even Order Pre-Distortion Circuit
Single Event Transient Direct Measurement Methodology and Circuit
Circuit and Method for Reducing the Propagation of Single Event Transient Effects
Wafer Structure for Electronic Integrated Circuit Manufacturing
Wafer Structure for Electronic Integrated Circuit Manufacturing
Wafer Structure for Electronic Integrated Circuit Manufacturing
Wafer Structure for Electronic Integrated Circuit Manufacturing
High-Stability Reset Circuit for Monitoring Supply Undervoltage and Overvoltage
Continuous-Time Circuit and Method for Capacitance Equalization Based on Electrically Tunable Voltage Pre-Distortion of a C-V Characteristic
Electrically Tunable Continuous-Time Circuit and Method for Compensating a Polynomial Voltage-Dependent Characteristic of Capacitance
Single Event Transient Direct Measurement Methodology and Circuit
Phase-Locked Loop (Pll) Fail-Over Circuit Technique and Method to Mitigate Effects of Single-Event Transients
High-Gain Low-Noise Preamplifier and Associated Amplification and Common-Mode Control Method
Integrated Circuit Shielding Technique Utilizing Stacked Die Technology Incorporating Top and Bottom Nickel-Iron Alloy Shields Having a Low Coefficient of Thermal Expansion
Low-Noise Low-Distortion Signal Acquisition Circuit and Method with Reduced Area Utilization
Voltage Regulator for Systems with a High Dynamic Current Range
Method for Synchronizing a Multiplicity of Clock Generating Circuits
Patent:
9,231,592 →
Application:
14/469,361 →
Method for Concurrent System Management and Error Detection and Correction Requests in Integrated Circuits Through Location Aware Avoidance Logic
Method for Creating a Reliable Phase-Locked Loop in a Ruggedized or Harsh Environment
Patent:
9,270,284 →
Application:
14/524,988 →
High-Gain Low-Noise Preamplifier and Associated Amplification and Common-Mode Control Method
Low-Noise Low-Distortion Signal Acquisition Circuit and Method with Reduced Area Utilization
Baseline Restore Sampling Method
Integrated Circuit Shielding Technique Utilizing Stacked Die Technology Incorporating Top and Bottom Nickel-Iron Alloy Shields Having a Low Coefficient of Thermal Expansion
Wafer Structure for Electronic Integrated Circuit Manufacturing
Bias-Starving Circuit with Precision Monitoring Loop for Voltage Regulators with Enhanced Stability
Wafer Structure for Electronic Integrated Circuit Manufacturing
Wafer Structure for Electronic Integrated Circuit Manufacturing
Wafer Structure for Electronic Integrated Circuit Manufacturing
Minimal-Energy Up/Down Counting Apparatus and Method for Extremely Low-Power Applications
Radiation-Hardened Break Before Make Circuit
Radiation-Hardened Break Before Make Circuit
Flip Chip Assembly
Methods of Modelling Irregular Shaped Transistor Devices in Circuit Simulation
Patent:
10,846,451 →
Application:
16/509,171 →
Detection and Correction of Single Event Upset (Seu) in Integrated Circuit
Pll with Multiple and Adjustable Phase Outputs
Related Assignments
(25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Oct 23, 2001
From: GARDNER, HARRY N.; KERWIN, DAVID
To: AEROFLEX UTMC MICROELECTRONIC SYSTEMS, INC.
Reel/Frame 012493/0178 →
Assignment of Assignor's Interest
Jun 15, 2004
From: GARDNER, HARRY N.
To: AEROFLEX COLORADO SPRINGS INC.
Reel/Frame 015480/0652 →
Assignment of Assignor's Interest
Mar 3, 2005
From: GARDNER, HARRY N.
To: AEROFLEX COLORADO SPRINGS INC.
Reel/Frame 016352/0396 →
Assignment of Assignor's Interest
Jan 20, 2006
From: VON THUN, MATTHEW
To: AEROFLEX COLORADO SPRINGS INC.
Reel/Frame 017502/0249 →
Assignment of Assignor's Interest
Feb 6, 2006
From: THUN, MATTHEW VON
To: AEROFLEX COLORADO SPRINGS INC.
Reel/Frame 017548/0978 →
Assignment of Assignor's Interest
Mar 3, 2006
From: VON THUN, MATTHEW
To: AEROFLEX COLORADO SPRINGS INC.
Reel/Frame 017652/0489 →
Assignment of Assignor's Interest
Jun 7, 2006
From: RYAN, KEVIN
To: AEROFLEX COLORADO SPRINGS INC.
Reel/Frame 017740/0527 →
Assignment of Assignor's Interest
Jun 7, 2006
From: RYAN, KEVIN
To: AEROFLEX COLORADO SPRINGS INC.
Reel/Frame 017740/0518 →
Assignment of Assignor's Interest
Jul 10, 2006
From: GRIFFITH, J. STEVE
To: AEROFLEX COLORADO SPRINGS INC.
Reel/Frame 017905/0167 →
Assignment of Assignor's Interest
Jul 11, 2006
From: THORNE, SEAN
To: AEROFLEX COLORADO SPRINGS INC.
Reel/Frame 017910/0604 →
Assignment of Assignor's Interest
Jan 9, 2007
From: GRIFFITH, J. STEVE; PFEIL, JOHN; STRATTON, SAM
To: AEROFLEX COLORADO SPRINGS INC.
Reel/Frame 018734/0347 →
Assignment of Assignor's Interest
Mar 16, 2007
From: GARDNER, HARRY N.
To: AEROFLEX COLORADO SPRINGS INC.
Reel/Frame 019025/0978 →
Assignment of Assignor's Interest
May 13, 2007
From: KERWIN, DAVID B.; CURBY, ROCKFORD
To: AEROFLEX COLORADO SPRINGS INC.
Reel/Frame 019284/0485 →
Security Agreement
Sep 17, 2007
From: AEROFLEX COLORADO SPRINGS, INC., AS SUCCESSOR IN INTEREST TO AEROFLEX UTMC MICROELECTRONIC SYSTEMS, INC.
To: GOLDMAN SACHS CREDIT PARTNERS, L.P., AS COLLATERAL AGENT
Reel/Frame 019834/0432 →
Security Agreement
Sep 17, 2007
From: AEROFLEX COLORADO SPRINGS, INC.
To: GOLDMAN SACHS CREDIT PARTNERS, L.P., AS COLLATERAL AGENT
Reel/Frame 019834/0442 →
Assignment of Assignor's Interest
May 15, 2008
From: KERWIN, DAVID B.
To: AEROFLEX COLORADO SPRINGS INC.
Reel/Frame 020955/0403 →
Assignment of Assignor's Interest
Dec 18, 2009
From: ZANCHI, ALFIO; HISANO, SHINICHI
To: AEROFLEX COLORADO SPRINGS INC.
Reel/Frame 023677/0664 →
Release of Security Interest in Intellectual Property Collateral
May 9, 2011
From: GOLDMAN SACHS CREDIT PARTNERS, L.P., AS COLLATERAL AGENT
To: AEROFLEX COLORADO SPRINGS, INC., AS SUCCESSOR IN INTEREST TO AEROFLEX UTMC MICROELECTRONIC SYSTEMS, INC.
Reel/Frame 026247/0401 →
Release of Security Interest in Intellectual Property Collateral
May 9, 2011
From: GOLDMAN SACHS CREDIT PARTNERS, L.P., AS COLLATERAL AGENT
To: AEROFLEX COLORADO SPRINGS, INC.
Reel/Frame 026247/0469 →
Change of Name
May 27, 2011
From: AEROFLEX UTMC MICROELECTRONIC SYSTEMS INC.
To: AEROFLEX COLORADO SPRINGS, INC.
Reel/Frame 026357/0804 →
Security Agreement
Jun 10, 2011
From: AEROFLEX INCORPORATED; AEROFLEX/WEINSCHEL, INC.; AEROFLEX COLORADO SPRINGS, INC.; AEROFLEX MICROELECTRONIC SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, NA, AS COLLATERAL AGENT
Reel/Frame 026422/0719 →
Release of Security Interest in Intellectual Property Collateral
Jul 1, 2011
From: GOLDMAN SACHS CREDIT PARTNERS, L.P., AS COLLATERAL AGENT
To: AEROFLEX COLORADO SPRINGS, INC.
Reel/Frame 026539/0435 →
Release of Patent Security Interest
Sep 12, 2014
From: JPMRGAN CHASE BANK, N.A.
To: AEROFLEX INCORPORATED; AEROFLEX/WEINSCHEL, INC.; AEROFLEX COLORADO SPRINGS, INC.; AEROFLEX MICROELECTRONIC SOLUTIONS, INC.
Reel/Frame 033728/0942 →
Change of Name
Apr 7, 2021
From: AEROFLEX COLORADO SPRINGS, INC.
To: COBHAM COLORADO SPRINGS INC.
Reel/Frame 055847/0958 →
Entity Conversion
Aug 22, 2022
From: COBHAM COLORADO SPRINGS INC.
To: CAES COLORADO SPRINGS LLC
Reel/Frame 061299/0490 →