Patent Assignment
Reel/Frame 026844/0467
Assignment of Assignor's Interest
Recorded: 2011-09-01
Pages: 3
Assignors
OKA, SEIJI
Executed: 2011-08-19
IDAKA, SHIORI
Executed: 2011-08-17
YOSHIDA, HIROSHI
Executed: 2011-08-19
Assignee
MITSUBISHI ELECTRIC CORPORATION
7-3, MARUNOUCHI 2-CHOME, CHIYODA-KU, TOKYO, 100-8310, JAPAN
Covered Property
(1)
Power Semiconductor Device, Printed Wiring Board, and Mechanism for Connecting the Power Semiconductor Device and the Printed Wiring Board