Power semiconductor device, printed wiring board, and mechanism for connecting the power semiconductor device and the printed wiring board
A power semiconductor device includes a conductive insertion member as an external terminal projecting from a surface of the power semiconductor device facing a printed wiring board. The printed wiring board includes a conductive fitting member mounted on a pad part of the printed wiring board. The fitting member receives the insertion member therein when the power semiconductor device is connected to the printed wiring board. The insertion member has a recessed portion formed on a side surface of the insertion member. The fitting member has a projecting portion with elasticity formed on an inner side surface of the fitting member. The elasticity causes the projecting portion of the fitting member to contact the recessed portion of the insertion member under pressure when the insertion member is inserted into the fitting member.
1. A power semiconductor device, comprising:
an internal substrate in which a semiconductor element is formed;
a molding resin covering a top surface of said internal substrate;
an opening penetrating said molding resin to reach a wiring on said internal substrate;
a metal bushing formed in said opening, the metal bushing being electrically connected to said wiring; and
an external terminal, at least a portion of the external terminal projecting from said opening,
said external terminal having a press-fitted portion inserted into said bushing, and a recessed portion formed on a side surface of part of said external terminal, the part projecting from said opening.
2. The power semiconductor device according to claim 1 , wherein said recessed portion is formed on each one of opposite side surfaces of said external terminal.
3. The power semiconductor device according to claim 1 , wherein said recessed portion has a surface in the form of an R shape.
4. The power semiconductor device according to claim 1 , wherein said external terminal includes a plurality of press-fitted portions.
5. The power semiconductor device according to claim 1 , wherein said external terminal is constructed of a metal plate with no bend.
6. The power semiconductor device according to claim 1 , wherein said power semiconductor device includes a plurality of external terminals having different sectional areas.
7. The power semiconductor device according to claim 1 , wherein said power semiconductor device includes a plurality of external terminals, said plurality of external terminals all having the same height.
8. The power semiconductor device according to claim 1 , wherein said power semiconductor device comprises a wide band gap semiconductor.