IP Library Assignment 026853/0040
Patent Assignment
Reel/Frame 026853/0040

Assignment of Assignor's Interest

Recorded: 2011-09-02 Pages: 3
Assignor
OGANESIAN, VAGE
Executed: 2011-08-05
Assignee
CHINA WLCSP US, INC.
889 PERIWINKLE TERRACE, SUNNYVALE, CALIFORNIA, 94086
Covered Property (1)
3D Integration Microelectronic Assembly for Integrated Circuit Devices
Patent: 8,546,951 →
Application: 13/157,207 →
Publication: US 2012/0313255
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Jun 19, 2012
From: CHINA WLCSP US, INC.
To: OPTIZ, INC.
Reel/Frame 028406/0571 →