Patent Assignment
Reel/Frame 026855/0766
Assignment of Assignor's Interest
Recorded: 2011-09-05
Pages: 3
Assignee
UNITED MICROELECTRONICS CORP.
NO.3, LI-HSIN ROAD 2, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU CITY, TAIWAN
Covered Property
(1)
Hierarchical Wafer Yield Predicting Method and Hierarchical Lifetime Predicting Method
Application:
13/225,495 →
Publication:
US 2013/0061188