IP Library › Assignment 026859/0724
Patent Assignment
Reel/Frame 026859/0724

Assignment of Assignor's Interest

Recorded: 2011-09-06 Pages: 4
Assignors
LEE, DONG-KAK
Executed: 2011-07-04
HWANG, HEE-DON
Executed: 2011-07-04
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416 MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property (1)
Semiconductor Trench Isolation Including Polysilicon and Nitride Layers
Patent: 8,766,355 →
Application: 13/225,896 →
Publication: US 2012/0056263