Semiconductor trench isolation including polysilicon and nitride layers
A semiconductor device includes a device isolation pattern in which a polysilicon layer pattern doped with oxygen, carbon or nitrogen is interposed between an inner wall of a trench and a nitride liner. The semiconductor device includes a semiconductor substrate including a trench, a polysilicon layer pattern on a surface of the trench, a nitride layer pattern on the polysilicon layer pattern, and an insulation layer pattern on the nitride layer pattern and filling the trench. The polysilicon layer pattern may be doped with oxygen, carbon and/or nitrogen. Related manufacturing methods are also disclosed.
1. A semiconductor device comprising:
a semiconductor substrate including a trench therein;
a polysilicon liner covering a bottom surface and sidewalls of the trench;
a nitride liner covering the polysilicon liner; and
a gap-fill insulation layer on the nitride liner, the gap-fill insulation layer having a lower surface and a side surface being surrounded by the polysilicon liner and the nitride liner,
wherein the polysilicon liner is doped with impurities,
wherein the gap-fill insulation layer pattern fills the trench, and
wherein the trench further comprises a trench opening and wherein the polysilicon liner on the sidewalls of the trench is recessed from the trench opening.
2. The semiconductor device of claim 1 , wherein the polysilicon liner is doped with oxygen.
3. The semiconductor device of claim 1 , wherein the polysilicon liner is doped with carbon.
4. The semiconductor device of claim 1 , wherein the polysilicon liner is doped with nitrogen.
5. The semiconductor device of claim 1 , further comprising an oxide liner interposed between the surface of the trench and the polysilicon liner.
6. The semiconductor device of claim 1 , further comprising a gate electrode structure on the semiconductor substrate.
7. The semiconductor device of claim 1 , further comprising a p-type metal oxide semiconductor field effect transistor (pMOSFET) in and/or on the semiconductor substrate.
8. A semiconductor device, comprising:
a semiconductor substrate including a trench therein;
a gate electrode structure on the semiconductor substrate; and
a device isolation pattern in the trench,
wherein the device isolation pattern comprises:
a polysilicon liner covering a bottom surface and sidewalls of the trench;
a nitride liner covering the polysilicon liner; and
a gap-fill insulation layer on the nitride liner, the gap-fill insulation layer having a lower surface and a side surface being surrounded by the polysilicon liner and the nitride liner,
wherein the polysilicon liner is doped with impurities,
wherein the gap-fill insulation layer pattern fills the trench, and
wherein the trench comprises a trench opening, and the polysilicon liner on the sidewalls of the trench is recessed from the trench opening.
9. The semiconductor device of claim 8 , wherein the gate electrode structure comprises:
a gate insulation layer on the semiconductor substrate; and
a gate electrode on the gate insulation layer.
10. The semiconductor device of claim 8 , wherein the semiconductor substrate also includes a recessed channel trench therein and wherein the gate electrode structure comprises:
a gate insulation layer inside the recessed channel trench; and
a gate electrode on the gate insulation layer that is in the recessed channel trench, and on the semiconductor substrate.
11. The semiconductor device of claim 8 , wherein the semiconductor substrate further comprises an active pattern that protrudes from an upper surface of the semiconductor substrate and extends in a first direction,
wherein the gate electrode structure comprises:
a gate insulation layer on two side surfaces of the active pattern; and
a gate electrode that surrounds the gate insulation layer on the active pattern and extends in a second direction.