IP Library Assignment 026871/0745
Patent Assignment
Reel/Frame 026871/0745

Assignment of Assignor's Interest

Recorded: 2011-09-08 Pages: 2
Assignor
HAUENSTEIN, HENNING M.
Executed: 2006-12-08
Assignee
INTERNATIONAL RECTIFIER CORPORATION
101 N. SEPULVEDA BLVD., EL SEGUNDO, CALIFORNIA, 90245
Covered Property (1)
Wafer Scale Package for High Power Devices
Patent: 8,368,210 →
Application: 13/225,987 →
Publication: US 2011/0316086
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger and Change of Name Mar 10, 2016
From: INTERNATIONAL RECTIFIER CORPORATION; INFINEON TECHNOLOGIES AMERICAS CORP.
To: INFINEON TECHNOLOGIES AMERICAS CORP.
Reel/Frame 037943/0053 →