Wafer scale package for high power devices
A semiconductor device package is formed of DBC in which thinned MOSgated and/or diode die are soldered to the bottom of an etched depression in the upper conductive layer. A via in the insulation layer of the DBC is filled with a conductive material to form a resistive shunt. Plural packages may be formed in a DBC card and may be separated individually or in clusters. The individual packages are mounted in various arrays on a support DBC board and heat sink. Integrated circuits may be mounted on the assembly and connected to the die for control of the die conduction.
1. A wafer scale package comprising:
a plurality of laterally spaced semiconductor packages separated by separation streets;
each of said semiconductor packages comprising a semiconductor die having first and second parallel surfaces and a support can;
said support can comprising an insulation body having top and bottom parallel surfaces with corresponding top and bottom conductive layers;
said top conductive layer having a depression therein defining a web surface and an upstanding rim portion extending around at least a portion of the periphery said web surface;
said die being disposed in said depression, said insulation body being severable in said separation streets to separate said semiconductor packages from one another.
2. The wafer scale package of claim 1 , wherein said semiconductor die for each of said semiconductor packages is a silicon MOSgated device.
3. The wafer scale package of claim 1 further comprising an electrode on said second parallel surface of said semiconductor die, said electrode being mechanically and electrically fixed to said web surface.
4. The wafer scale package of claim 3 , wherein said electrode is a source or a drain electrode of a silicon MOSgated device.
5. The wafer scale package of claim 4 , wherein said electrode is a bump contact.
6. A wafer scale package comprising:
a plurality of laterally spaced semiconductor packages separated by separation streets;
each of said semiconductor packages comprising a semiconductor die having first and second surfaces and first and second electrodes on each of said first and second surfaces, respectively, and a support can for supporting said semiconductor die;
said support can comprising an insulation body having top and bottom parallel surfaces and top and bottom conductive layers on said top and bottom surfaces respectively;
said top conductive layer having a depression therein defining a web surface and a rim portion, said die being disposed in said depression with said second electrode mechanically and electrically fixed to said web surface;
said insulation body being severable in said separation streets to separate said semiconductor packages from one another.
7. The wafer scale package of claim 6 , wherein said semiconductor die for each of said semiconductor packages is a silicon MOSgated device.
8. The wafer scale package of claim 6 , wherein said second electrode is a source or a drain electrode of a silicon MOSgated device.
9. The wafer scale package of claim 6 , wherein said first electrode is a bump contact.
10. The wafer scale package of claim 6 , wherein said second electrode is a bump contact.
11. The wafer scale package of claim 6 , wherein said rim portion has a general U shape.