Patent Assignment
Reel/Frame 026873/0353
Assignment of Assignor's Interest
Recorded: 2011-09-08
Pages: 2
Assignors
CHU, JUNG-TANG
Executed: 2011-09-02
CHIU, CHING-HUA
Executed: 2011-09-02
HUANG, HUNG-WEN
Executed: 2011-09-02
LEE, YEA-CHEN
Executed: 2011-09-02
HSIA, HSING-KUO
Executed: 2011-09-05
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Forming Light-Emitting Diodes Using Seed Particles
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Apr 4, 2012
From: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
To: TSMC SOLID STATE LIGHTING LTD.
Reel/Frame 027989/0866 →
Merger
Mar 26, 2016
From: CHIP STAR LTD.
To: EPISTAR CORPORATION
Reel/Frame 038107/0962 →
Change of Name
Mar 26, 2016
From: TSMC SOLID STATE LIGHTING LTD.
To: CHIP STAR LTD.
Reel/Frame 038263/0076 →