IP Library › Assignment 027989/0866
Patent Assignment
Reel/Frame 027989/0866

Assignment of Assignor's Interest

Recorded: 2012-04-04 Pages: 3
Assignor
Assignee
TSMC SOLID STATE LIGHTING LTD.
9, LI-HSIN 4TH ROAD, HSINCHU SCIENCE PARK, HSINCHU, 300-77, TAIWAN
Covered Property (1)
Forming Light-Emitting Diodes Using Seed Particles
Patent: 8,546,165 →
Application: 13/227,905 →
Publication: US 2012/0104409
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 8, 2011
From: CHU, JUNG-TANG; CHIU, CHING-HUA; HUANG, HUNG-WEN; LEE, YEA-CHEN
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 026873/0353 →
Merger Mar 26, 2016
From: CHIP STAR LTD.
To: EPISTAR CORPORATION
Reel/Frame 038107/0962 →
Change of Name Mar 26, 2016
From: TSMC SOLID STATE LIGHTING LTD.
To: CHIP STAR LTD.
Reel/Frame 038263/0076 →