Patent Assignment
Reel/Frame 026874/0471
Assignment of Assignor's Interest
Recorded: 2011-09-08
Pages: 3
Assignors
KUO, CHEN-CHENG
Executed: 2011-09-01
CHUANG, CHITA
Executed: 2011-09-01
LIN, TSUNG-SHU
Executed: 2011-09-01
CHEN, CHEN-SHIEN
Executed: 2011-09-01
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN ROAD 6, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Elongated Bump Structure in Semiconductor Device