IP Library › Assignment 026887/0912
Patent Assignment
Reel/Frame 026887/0912

Assignment of Assignor's Interest

Recorded: 2011-09-12 Pages: 2
Assignors
OHTAKE, HIROTO
Executed: 2008-06-23
TADA, MUNEHIRO
Executed: 2008-06-23
UEKI, MAKOTO
Executed: 2008-06-23
HAYASHI, YOSHIHIRO
Executed: 2008-06-23
Assignee
NEC CORPORATION
7-1, SHIBA 5-CHOME, MINATO-KU, TOKYO, JAPAN
Covered Property (1)
Method of Producing a Dual Damascene Multilayer Interconnection and Multilayer Interconnection Structure
Application: 13/227,031 →
Publication: US 2011/0316161
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Oct 19, 2012
From: NEC CORPORATION
To: NEC ELECTRONICS CORPORATION
Reel/Frame 029157/0577 →
Merger Oct 19, 2012
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 029157/0830 →