IP Library › Assignment 029157/0577
Patent Assignment
Reel/Frame 029157/0577

Assignment of Assignor's Interest

Recorded: 2012-10-19 Pages: 5
Assignor
NEC CORPORATION
Executed: 2010-03-31
Assignee
NEC ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI, KANAGAWA, 211-8668, JAPAN
Covered Property (1)
Method of Producing a Dual Damascene Multilayer Interconnection and Multilayer Interconnection Structure
Application: 13/227,031 →
Publication: US 2011/0316161
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 12, 2011
From: OHTAKE, HIROTO; TADA, MUNEHIRO; UEKI, MAKOTO; HAYASHI, YOSHIHIRO
To: NEC CORPORATION
Reel/Frame 026887/0912 →
Merger Oct 19, 2012
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 029157/0830 →