IP Library › Assignment 029157/0830
Patent Assignment
Reel/Frame 029157/0830

Merger

Recorded: 2012-10-19 Pages: 5
Assignor
NEC ELECTRONICS CORPORATION
Executed: 2010-04-01
Assignee
RENESAS ELECTRONICS CORPORATION
1753, SHIMONUMABE, NAKAHARA-KU, KAWASAKI-SHI, KANAGAWA, JAPAN
Covered Property (1)
Method of Producing a Dual Damascene Multilayer Interconnection and Multilayer Interconnection Structure
Application: 13/227,031 →
Publication: US 2011/0316161
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 12, 2011
From: OHTAKE, HIROTO; TADA, MUNEHIRO; UEKI, MAKOTO; HAYASHI, YOSHIHIRO
To: NEC CORPORATION
Reel/Frame 026887/0912 →
Assignment of Assignor's Interest Oct 19, 2012
From: NEC CORPORATION
To: NEC ELECTRONICS CORPORATION
Reel/Frame 029157/0577 →