IP Library › Assignment 026937/0224
Patent Assignment
Reel/Frame 026937/0224

Assignment of Assignor's Interest

Recorded: 2011-09-20 Pages: 4
Assignors
NGUYEN, BICH-YEN
Executed: 2011-09-16
SADAKA, MARIAM
Executed: 2011-09-16
Assignee
S.O.I.TEC SILICON ON INSULATOR TECHNOLOGIES
CHEMIN DES FRANQUES, PARC TECHNOLOGIQUE DES FONTAINES, BERNIN, 38190, FRANCE
Covered Property (1)
Methods of Forming Bonded Semiconductor Structures Including Interconnect Layers Having One or More of Electrical, Optical, and Fluidic Interconnects Therein, and Bonded Semiconductor Structures Formed Using Such Methods
Patent: 8,728,863 →
Application: 13/206,242 →
Publication: US 2013/0037959
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Feb 28, 2012
From: S.O.I. TEC SILICON ON INSULATOR TECHNOLOGIES; CHEMIN DES FRANQUES; PARC TECHNOLOGIES DES FONTAINES; BERNIN. FRANCE 38190
To: SOITEC
Reel/Frame 028138/0895 →
Assignment of Assignor's Interest Feb 4, 2020
From: SOITEC
To: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
Reel/Frame 051707/0878 →