IP Library › Assignment 027004/0319
Patent Assignment
Reel/Frame 027004/0319

Assignment of Assignor's Interest

Recorded: 2011-10-03 Pages: 4
Assignors
SADAKA, MARIAM
Executed: 2011-09-27
NGUYEN, BICH-YEN
Executed: 2011-09-27
Assignee
S.O.I.TEC SILICON ON INSULATOR TECHNOLOGIES
CHEMIN DES FRANQUES, PARC TECHNOLOGIQUE DES FONTAINES, BERNIN, 38190, FRANCE
Covered Property (1)
Methods of Forming Bonded Semiconductor Structures in 3D Integration Processes Using Recoverable Substrates, and Bonded Semiconductor Structures Formed by Such Methods
Patent: 8,617,925 →
Application: 13/206,280 →
Publication: US 2013/0037960
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Feb 28, 2012
From: S.O.I. TEC SILICON ON INSULATOR TECHNOLOGIES; CHEMIN DES FRANQUES; PARC TECHNOLOGIES DES FONTAINES; BERNIN. FRANCE 38190
To: SOITEC
Reel/Frame 028138/0895 →
Assignment of Assignor's Interest Feb 4, 2020
From: SOITEC
To: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
Reel/Frame 051707/0878 →