Patent Assignment
Reel/Frame 027024/0974
Assignment of Assignor's Interest
Recorded: 2011-10-06
Pages: 4
Assignors
YU, CHEN-HUA
Executed: 2011-09-05
CHANG, HUNG-PIN
Executed: 2011-09-05
SU, AN-JHIH
Executed: 2011-09-05
WU, TSANG-JIUH
Executed: 2011-09-05
CHIOU, WEN-CHIH
Executed: 2011-09-05
JENG, SHIN-PUU
Executed: 2011-09-05
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Bump with Protection Structure