Patent Assignment
Reel/Frame 027038/0326
Assignment of Assignor's Interest
Recorded: 2011-10-10
Pages: 3
Assignor
RICHTER, FRANZ
Executed: 2011-09-29
Assignee
THIN MATERIALS AG
ELSTERSTRASSE 23, EICHENAU, 82223, GERMANY
Covered Property
(1)
Method for Separating a Layer System Comprising a Wafer by Precisely Maintaining the Position of the Separating Front
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.