Patent Assignment
Reel/Frame 027052/0872
Assignment of Assignor's Interest
Recorded: 2011-10-12
Pages: 5
Assignors
DREIZA, MAHMOUD
Executed: 2011-09-28
BALLANTINE, ANDREW
Executed: 2011-09-28
SHUMWAY, RUSSELL SCOTT
Executed: 2011-09-16
Assignee
AMKOR TECHNOLOGY, INC.
1900 SOUTH PRICE ROAD, CHANDLER, ARIZONA, 85286-6604
Covered Property
(1)
Molded Cavity Substrate Mems Package Fabrication Method and Structure
Patent:
9,029,962 →
Application:
13/272,096 →
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Patent Security Agreement
May 7, 2015
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 035613/0592 →
Security Interest
Aug 1, 2018
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 046683/0139 →
Assignment of Assignor's Interest
Oct 12, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054046/0673 →