Patent Assignment
Reel/Frame 027053/0700
Assignment of Assignor's Interest
Recorded: 2011-10-13
Pages: 3
Assignors
WU, HUI-MIN
Executed: 2011-10-06
WANG, MING-I
Executed: 2011-10-06
WANG, KUAN-YU
Executed: 2011-10-06
HSIEH, KUN-CHE
Executed: 2011-10-06
HUANG, CHIEN-HSIN
Executed: 2011-10-06
Assignee
UNITED MICROELECTRONICS CORPORATION
NO. 3, LI-HSIN RD. II, SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, TAIWAN
Covered Property
(1)
Bond Pad Structure and Fabricating Method Thereof
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.