Patent Assignment
Reel/Frame 027072/0735
Assignment of Assignor's Interest
Recorded: 2011-10-17
Pages: 2
Assignors
KAGAYA, YUTAKA
Executed: 2008-07-25
WATANABE, FUMITOMO
Executed: 2008-07-25
TAKASAKI, HAJIME
Executed: 2008-07-25
Assignee
ELPIDA MEMORY, INC.
2-1, YAESU 2-CHOME, CHUO-KU, TOKYO, JAPAN
Covered Property
(1)
Semiconductor Device Having a First Conductive Member Connecting a Chip to a Wiring Board Pad and a Second Conductive Member Connecting the Wiring Board Pad to a Land on an Insulator Covering the Chip and the Wiring Board
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Agreement
Jul 29, 2013
From: PS4 LUXCO S.A.R.L.
To: ELPIDA MEMORY INC.
Reel/Frame 032414/0261 →
Assignment of Assignor's Interest
May 15, 2014
From: ELPIDA MEMORY, INC.
To: PS4 LUXCO S.A.R.L.
Reel/Frame 032900/0568 →
Change of Name
Aug 24, 2016
From: PS5 LUXCO S.A.R.L.
To: LONGITUDE SEMICONDUCTOR S.A.R.L.
Reel/Frame 039793/0880 →
Assignment of Assignor's Interest
Aug 24, 2016
From: PS4 LUXCO S.A.R.L.
To: PS5 LUXCO S.A.R.L.
Reel/Frame 039818/0506 →
Assignment of Assignor's Interest
Aug 21, 2018
From: LONGITUDE SEMICONDUCTOR S.A.R.L.
To: LONGITUDE LICENSING LIMITED
Reel/Frame 046867/0248 →